Adhesive bonding and miscellaneous chemical manufacture – Methods – Making electrical conductors of indefinite length
Reexamination Certificate
2005-11-29
2005-11-29
Lam, Cathy F. (Department: 1775)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Making electrical conductors of indefinite length
C156S060000
Reexamination Certificate
active
06969436
ABSTRACT:
A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
REFERENCES:
patent: 5057372 (1991-10-01), Imfeld et al.
patent: 5567329 (1996-10-01), Rose et al.
patent: 6138350 (2000-10-01), Bhatt et al.
patent: 6163957 (2000-12-01), Jiang et al.
patent: 6440542 (2002-08-01), Kariya
patent: 2000165050 (2000-12-01), None
Brodock Keith P.
Curcio Brian E.
Farquhar Donald S.
Jimarez Lisa J.
Driggs Lucas Brubaker & Hogg Co. LPA
Hogg William N.
Lam Cathy F.
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