Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Patent
1997-10-31
1999-10-19
Dutton, Brian
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Electrical characteristic sensed
438 18, 324765, H01L 2100, H01L 2166, G01R 3126
Patent
active
059703113
ABSTRACT:
A method and structure for optimizing the performance of a semiconductor device having dense transistors. A method consistent with the present invention includes forming a first test structure on a first substrate portion. The first test structure includes a transistor having a gate electrode formed at a design width and at a first line spacing similar to the line spacing of a dense transistor. One or more electrical properties the transistor of the first test structure is measured. A second test structure is formed on a second substrate portion. The second test structure includes a transistor having a gate electrode formed at the same design width as the transistor of the first test structure and at a second line spacing greater than the first line spacing. One or more electrical properties of the transistor of the second test structure are measured. Using the measured one or more electrical properties, one or more relationships are developed between the measured one or more electrical properties and the transistors at the first line spacing and the second line spacing.
REFERENCES:
patent: 5304925 (1994-04-01), Ebina
patent: 5598010 (1997-01-01), Uematsu
patent: 5760600 (1998-06-01), Kasai
Cheek Jon
Kadosh Daniel
Wristers Derick J.
Advanced Micro Devices
Dutton Brian
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