Method and structure for measuring a bonding resistance

Details Method and structure for measuring a bonding resistance Method and structure for measuring a bonding resistance

2006-06-20

2006-06-20

Benson, Walter (Department: 2858)

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

C324S701000

Reexamination Certificate

active

07064563

ABSTRACT:
A structure and a method for measuring the bonding resistance are provided. The structure for measuring a bonding resistance between a first object and a second object is provided, wherein the first object has a plurality of first pins and a reference pin, and the second object has a plurality of second pins corresponding to the plurality of first pins and the reference pin. The structure further includes a first circuit formed by electrically connecting the reference pin to the first pin adjacent to the reference pin in a first direction, and a second circuit formed by electrically connecting a second pin corresponding to the reference pin to the adjacent second pin in a second direction. By connecting the first and the second circuits in series, the value of the bonding resistance is easily measured.

REFERENCES:
patent: 6940301 (2005-09-01), Chen

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