Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-04-03
2007-04-03
Doan, Theresa T. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S701000
Reexamination Certificate
active
11146889
ABSTRACT:
A semiconductor package structure for a ball grid array type package using a plurality of pieces of adhesive elastomer film to attach a semiconductor die to a substrate having conductive traces in order to alleviate thermal mismatch stress between the semiconductor die and the printed circuit board to which the packaged device is soldered, while maintaining the reliability of the packaged device itself.
REFERENCES:
patent: 6294040 (2001-09-01), Raab et al.
patent: 6774480 (2004-08-01), Jiang
Doan Theresa T.
Dorsey & Whitney LLP
Micro)n Technology, Inc.
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