Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2004-05-27
2008-03-18
Sells, James (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S258000, C156S304200, C156S304300, C156S304500
Reexamination Certificate
active
07344611
ABSTRACT:
A method of joining two components of a vinyl frame provides first and second components each having an end and having surfaces defining at least one channel open at the end and extending into the associated component. A coupling structure is provided and has at least a first member and a second member and includes energy receiving structure. The first member is inserted to extend at least partially into the channel of the first component and the second member is inserted so as to extend at least partially into the channel of the second component so that the energy receiving structure is generally adjacent to certain surfaces defining the associated channel. Energy is directed to the coupling structure to cause the energy receiving structure to fuse with the certain surfaces, thereby joining the first and second components together. Improved component sealing and water pathways are also provided.
REFERENCES:
patent: 5902657 (1999-05-01), Hanson et al.
patent: 6103035 (2000-08-01), Hanson et al.
patent: 7122088 (2006-10-01), Field et al.
patent: 2004/0108040 (2004-06-01), Field et al.
patent: WO 02/098635 (2002-12-01), None
Manelli Denison & Selter
Sells James
Stemberger Edward J.
VinylLink LLC
LandOfFree
Method and structure for joining and sealing two components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and structure for joining and sealing two components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and structure for joining and sealing two components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3978211