Method and structure for interfacing electronic devices

Details Method and structure for interfacing electronic devices Method and structure for interfacing electronic devices

2005-03-22

2005-03-22

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S780000, C257S786000, C438S613000

Reexamination Certificate

active

06870270

ABSTRACT:
Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts, decrease planarization uniformity requirements, and facilitate contact bonding at lower temperatures and pressures by employing shapes and materials that respond predictably to compressive interfacing loads.

REFERENCES:
patent: 6005292 (1999-12-01), Roldan et al.
patent: 6216941 (2001-04-01), Yokoyama et al.
patent: 6495397 (2002-12-01), Kubota et al.
patent: 6555917 (2003-04-01), Heo

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