Method and structure for implementing enhanced...

Details Method and structure for implementing enhanced... Method and structure for implementing enhanced...

2007-02-06

2007-02-06

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C361S792000, C029S847000

Reexamination Certificate

active

10403148

ABSTRACT:
A method and structure are provided for implementing enhanced interconnection performance of an electrical connector, such as a land grid array (LGA) module, and a printed wiring board. A multi-layer printed wiring board includes a plurality of predefined ground and power layers. At least one of the predefined ground and power layers includes a thickness variation minimizing structure for minimizing thickness variation. The thickness variation minimizing structure includes a perforated pattern within a selected area of the at least one of the predefined ground and power layers. The selected area is proximate to predefined module sites, such as land grid array (LGA) module sites, in the ground and power layers. The selected area can include regions surrounding each predefined module site, and also can include a region within the module site.

REFERENCES:
patent: 5315069 (1994-05-01), Gebara
patent: 6366466 (2002-04-01), Leddige et al.
patent: 6380633 (2002-04-01), Tsai
patent: 6597187 (2003-07-01), Eldridge et al.
patent: 6710258 (2004-03-01), Oggioni et al.

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