Method and structure for identifying lead-free solder

Details Method and structure for identifying lead-free solder Method and structure for identifying lead-free solder

2007-08-07

2007-08-07

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S840000, C228S180100, C228S180210, C228S180220, C438S612000, C438S613000

Reexamination Certificate

active

09964746

ABSTRACT:
A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder may be heated so as to create reflow. The solder may later be examined to determine if the solder is lead-free.

REFERENCES:
patent: 6123248 (2000-09-01), Tadauchi et al.
patent: 6296722 (2001-10-01), Nishimura
patent: 7074627 (2006-07-01), Burnette et al.
patent: 01-004395 (1989-01-01), None
Pb-Free External Lead Finishes for Electronic Components: Tiin-Bismuth & Tin Silver By Ron Schetty 1998 IEMT Proceedings p. 380-385.
Interfacial Reactions Between Lead-Free SnAgCu Solder and Ni(P) Surface Finish on Printed Circuit Boards by Zeng et al. IEE Trans on Electronics Packaging Manufacturing, vol. 25, No. 3, Jul. 2002, p. 162-167.
Interactions of Lead (pb) in Lead Free Solder (Sn/Ag/Cu) System by Chung et al, 2002 Electronic Components and Technolog Conference, p. 168-175.

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