Method and structure for high power HTS transmission lines using

Superconductor technology: apparatus – material – process – High temperature devices – systems – apparatus – com- ponents,... – High frequency waveguides – resonators – electrical networks,...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

505238, 505701, 505703, 505866, 333204, 333995, 428210, 428702, 428930, H01B 1202, H01P 300

Patent

active

059226501

ABSTRACT:
Microstrip/stripline transmission lines have a plurality of strips on a substrate where strips are separated by a gap. This arrangement results in a reduced maximum current density compared to previous transmission lines with the same power handling capability. The strips can have the same width or different widths. The gaps can have the same width or different widths. The transmission lines can be used in filters and resonators and can be made of high temperature superconductive materials.

REFERENCES:
patent: 4441088 (1984-04-01), Anderson
patent: 5012319 (1991-04-01), Dykaar et al.
patent: 5219827 (1993-06-01), Higaki et al.
patent: 5404119 (1995-04-01), Kim
patent: 5406233 (1995-04-01), Shih et al.
patent: 5426399 (1995-06-01), Matsubayashi et al.
patent: 5496795 (1996-03-01), Das
patent: 5616538 (1997-04-01), Hey-Shipton et al.
patent: 5703020 (1997-12-01), Das
Steven T. Ruggiero et al., Superconducting Devices, Academic Press, Inc. 1990, pp. 258-243, 1990.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and structure for high power HTS transmission lines using does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and structure for high power HTS transmission lines using, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and structure for high power HTS transmission lines using will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2275585

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.