Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-09-24
2010-11-23
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S021000
Reexamination Certificate
active
07838336
ABSTRACT:
A method of making an integrated circuit package includes forming a through hole in an integrated circuit and assembling a die containing the integrated circuit on a carrier so that the die is mechanically and electrically connected to the carrier. Thereafter, an underfill material is dispensed between the die and the carrier via the through hole.
REFERENCES:
patent: 7303935 (2007-12-01), DeNatale et al.
patent: 2002/0076919 (2002-06-01), Peters et al.
patent: 2008/0293191 (2008-11-01), Nakanishi et al.
Alec J. Babiarz; “Paradigm Shift in Applying Underfill”; Asymtek, Carlsbad, CA; ajbabiarz@asymtek.com.
Bartley Gerald K.
Becker Darryl J.
Dahlen Paul E.
Germann Philip R.
Maki Andrew B.
Dillon & Yudell LLP
International Business Machines - Corporation
Mulpuri Savitri
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