Method and structure for a surface mountable rigid-flex printed

Details Method and structure for a surface mountable rigid-flex printed Method and structure for a surface mountable rigid-flex printed

1998-01-20

1999-09-21

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361749, 361751, 361803, H05K 111

Patent

active

059562340

ABSTRACT:
A method and structure for a surface mountable rigid-flex printed circuit board is disclosed. A rigid-flex circuit board is mounted onto a printed circuit board using standard surface mount technology such as ball grid array, pin grid array or solder screen print.
The use of rigid-flex board allows tested, burned in components to be used while still allowing a small multiple chip module footprint.

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Gilleo, "A Simplified Version of the Multilayer Circuit Process", Electronic Packaging & Production, Feb. 1989 (4 pages).
Markstein, "Rigid-Flex: a Maturing Technology", Electronic Packaging & Production, Feb. 1996 (7 pages).
Advertorial, "New Test Demands for Chip-to-Chip Interconnect", Electronic Packaging & Production (1 page).

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