Method and stencil design for printing non-planar hybrid circuit

Details Method and stencil design for printing non-planar hybrid circuit Method and stencil design for printing non-planar hybrid circuit

1993-05-21

1994-11-29

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 97, 427282, 427404, 427409, 101127, 10112821, 1011284, 101129, C23C 2600

Patent

active

053688830

ABSTRACT:
The present invention includes a method and stencil design for printing on non-planar hybrid substrates wherein the stencil has a bottom face with a reverse topography to the non-planar hybrid substrate such that the stencil comes in direct contact and rest on the printing area immediately surrounding the print hole formed in the stencil. This eliminates any gap between the stencil and the surface of the substrate where material is to be printed. The stencil may be a metal and may be etched to provide the reversed topography.

REFERENCES:
patent: 4678531 (1987-07-01), Metzger
patent: 4800461 (1989-01-01), Dixon
patent: 4919969 (1990-04-01), Walker
L. M. Balents "A Metal Mask And Screen Assembly For Printing Thick-Film Onto Substrates Having Microminiature Devices Mounted Thereon" RCA TN 978, Sep., 1974, pp. 1-2.

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