Method and solution for cleaning solder connections of electroni

Details Method and solution for cleaning solder connections of electroni Method and solution for cleaning solder connections of electroni

1996-08-20

1998-06-02

Marschel, Ardin H.

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 6, 134 34, 134 40, 134 41, 510175, C23G 102, C23G 502

Patent

active

057592853

ABSTRACT:
A composition for cleaning solder to remove flux, flux reaction products, residues, including residues from manufacturing operations such as plating and photoresist residues and other contaminants, without any significant dissolution of the solder especially solder used in fabricating electronic components such as C4 area array flip chip connectors, is provided. The composition comprises a non-aromatic sulfonic acid and a substituted alcohol with a preferred composition comprising 3 weight % methanesulfonic acid and 97 weight % trifluoroethanol. A method for cleaning solder and solder containing components made using the cleaning method and composition of the invention are also disclosed.

REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 4270933 (1981-06-01), Meny et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5512613 (1996-04-01), Afzali-Ardakani et al.
patent: 5612303 (1997-03-01), Takayanagi et al.

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