Method and socket assembly for testing ball grid array...

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Reexamination Certificate

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C324S755090, C324S765010

Reexamination Certificate

active

11336918

ABSTRACT:
A method for testing a ball grid array package includes the following steps. Firstly, a printed circuit board having a plurality of contact pads thereon is provided. Then, a ball grid array test socket assembly having a connecting interface, a plurality of resilient contact members and a plurality of conducting members penetrating through the connecting interface is provided. The first terminal of each conducting member is in contact with the second terminal of corresponding resilient contact member. The second terminal of each conducting member is in contact with corresponding contact pad on the printed circuit board. Afterwards, the ball contacts of the ball grid array package are in contact with corresponding first terminals of the resilient contact members so as to test the ball grid array package.

REFERENCES:
patent: 4918384 (1990-04-01), Giringer et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 6150829 (2000-11-01), Cuevas
patent: 6246246 (2001-06-01), Hembree
patent: 6292003 (2001-09-01), Fredrickson et al.
patent: WO 96/08056 (1996-03-01), None

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