Method and semiconductor structure for monitoring the...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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C438S018000

Reexamination Certificate

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07491555

ABSTRACT:
By measuring an electric characteristic of a test pad that is connected to a plurality of test vias formed in accordance with a specified process flow for forming contacts and vias of a semiconductor device, one or more process specific parameters may quantitatively be estimated. Thus, a fast and precise measurement method for contacts and vias is provided in a non-destructive manner.

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patent: 5981302 (1999-11-01), Alswede et al.
patent: 6777676 (2004-08-01), Wang et al.
patent: 2003/0167632 (2003-09-01), Thomas et al.
patent: 2005/0017361 (2005-01-01), Lin et al.
patent: 2005/0070085 (2005-03-01), Huang et al.
patent: 2006/0246718 (2006-11-01), Frohberg et al.
patent: WO 03/067653 (2003-08-01), None

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