Method and semi-product for producing a chip card with a coil

Details Method and semi-product for producing a chip card with a coil Method and semi-product for producing a chip card with a coil

2006-12-26

2006-12-26

Vigushin, John B. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S782000, C361S783000, C257S679000, C029S600000, C029S601000, C029S832000, C029S842000, C438S057000, C438S059000, C438S064000

Reexamination Certificate

active

07154758

ABSTRACT:
The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).

REFERENCES:
patent: 5880934 (1999-03-01), Haghiri-Tehrani
patent: 5892661 (1999-04-01), Stafford et al.
patent: 6412702 (2002-07-01), Ishikawa et al.
patent: 0 682 321 (1995-11-01), None
patent: 0 996 082 (2000-04-01), None

Affiliated with

Also associated with

Rating

Method and semi-product for producing a chip card with a coil does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and semi-product for producing a chip card with a coil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and semi-product for producing a chip card with a coil will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3719613