Method and resulting structure for manufacturing...

Details Method and resulting structure for manufacturing... Method and resulting structure for manufacturing...

2005-07-19

2005-07-19

Kang, Donghee (Department: 2811)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C438S459000, C257S619000, C257S620000, C257S621000

Reexamination Certificate

active

06919261

ABSTRACT:
A semiconductor wafer composite is used as a basis for fabricating semiconductor chips, especially compound semiconductor devices. The semiconductor wafer composite advantageously comprises a metallic substrate210and multiple semiconductor tiles220bonded to the surface of the metallic substrate210. The semiconductor wafer composite is effectively used as a single large semiconductor wafer for volume fabrication, and can be used to fabricate semiconductor devices in a similar manner.

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Derwent Abstract Accession No. 85-187602/31, JP60-116749 A (Sumitomo Elec Ind. KK), Jun. 24 195.
Derwent Abstract Accession No. 85-187602/31, JP60-116749 A (Sumitomo Elec Ind. KK), Jun. 24 195.

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