Method and reference standards for measuring overlay in multilay

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364559, G01B 1127, G01D 1800

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056173407

ABSTRACT:
Imaging instruments for inspecting products, such as semiconductor chips, are calibrated by providing a reference test structure having features which can be located by electrical measurements not subject to tool-induced shift and wafer-induced shift experienced by the imaging instrument. The reference test structure is first qualified using electrical measurements, and is then used to calibrate the imaging instrument. The electrical measurements may be made by forcing a current between a plurality of spaced reference features and an underlying conductor, or may be made by capacitive, conductive, magnetic, or impedance-measuring techniques. Capacitive techniques may also be used to detect features not susceptible of resistance measurement, such as dielectric or insulative materials, or metallic structures not accessible for forcing a current therethrough. A series of test structure elements may be fabricated with one component of each being spaced at progressively greater distances from an arbitrary baseline, such that a null-overlay element may be identified.

REFERENCES:
patent: 3974443 (1976-08-01), Thomas
patent: 4481616 (1984-11-01), Matey
patent: 4516071 (1985-05-01), Buehler
patent: 4538105 (1985-08-01), Ausschnitt
patent: 4571538 (1986-02-01), Chow
patent: 4672314 (1987-06-01), Kokkas
patent: 4810335 (1989-03-01), Hieber
patent: 4918377 (1990-04-01), Buehler et al.
patent: 4983908 (1991-01-01), Tada et al.
patent: 5140272 (1992-08-01), Nishimatsu et al.
patent: 5280437 (1994-01-01), Corliss
Yen et al, "A Cross-Bridge . . . ", J. Electrochem Solid-State Science and echnology Oct. 1982, pp. 2313-2318.
Feldbaumer et al, "Design and Application . . . ", IEEE Transactions on Semiconductor Manufacturing, vol 3, No. 4, Nov. 1990, 206-215.
Troccolo et al, "Extending Electrical . . . ", SPIE, vol. 1441, pp. 90-103.
Cresswell et al, "A Modified Sliding Wire . . . ", IEEE Int. Conference on Microelectronic Test Structures, vol. 4, No. 1, Mar. 1991.
Buehler et al., "The Split-Cross-Bridge . . . ", IEEE Transactions on Electronic Devices, vol. ED-33, No. Oct. 1986.
Troccolo et al, "Tool and mark design . . . ", SPIE vol. 1673, 1992, 148-156.
Allen et al, "Voltage-Diving Potentiometer", Proc. IEEE Int. Conference on Microelectronic Test Structures, vol. 5, Mar. 1992, 174-179.
Kuroki et al, "X-ray Exposure Mask . . . "Proc. IEEE Int. Conference on Microelectronic Test Structures, vol. 4, No. 1, Mar. 1991, 123-134.

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