Method and reduction solution for metallizing a surface

Details Method and reduction solution for metallizing a surface Method and reduction solution for metallizing a surface

1994-12-02

1996-08-13

Bowers, Jr., Charles L.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427305, 427437, B05D 512, B05D 309, B05D 310, B05D 118

Patent

active

055454305

ABSTRACT:
A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu.sub.2 O particles (300) mixed uniformly throughout the resin. The circuit board (100) is sprayed with a reduction solution to form catalytic islands (301) predominately of Cu.sup.0 or CuH. The circuit board (100) is then electrolessly plated to form conductors, pads or vias, where the resin A (204) has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.

REFERENCES:
patent: 4002778 (1977-01-01), Bellis et al.
patent: 4450190 (1984-05-01), Nuzzi et al.
patent: 4590115 (1986-05-01), Cassat
patent: 5162144 (1992-11-01), Brown et al.
patent: 5260170 (1993-11-01), Brown

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