Method and program for correcting and testing mask pattern...

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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C382S145000, C382S181000

Reexamination Certificate

active

07974457

ABSTRACT:
A method of testing a mask pattern, includes applying optical proximity-effect compensation to a first pattern to be tested and to be formed onto a mask layer, to thereby form a mask pattern of the mask layer, dividing the first pattern into a plurality of areas in accordance with a second pattern to be formed onto another mask layer, determining sampling points on an edge of the first pattern, determining a test standard for each of the areas, simulating a resist pattern formed on a resist by exposing the resist to a light through the mask pattern, and checking whether a dimensional gap between the first pattern and the resist pattern at each of the sampling points is within a test standard associated with an area to which each of the sampling points belongs, wherein test standards for first and second areas among the areas are different from each other.

REFERENCES:
patent: 5705301 (1998-01-01), Garza et al.
patent: 5991006 (1999-11-01), Tsudaka
patent: 6174633 (2001-01-01), Tounai
patent: 6316163 (2001-11-01), Magoshi et al.
patent: 6350977 (2002-02-01), Taoka
patent: 6453274 (2002-09-01), Kamon
patent: 6665858 (2003-12-01), Miyazaki
patent: 6907596 (2005-06-01), Kobayashi et al.
patent: 2002/0043615 (2002-04-01), Tounai et al.
patent: 11-096200 (1999-09-01), None
patent: 11-338904 (1999-10-01), None
patent: 2000-214577 (2000-04-01), None
patent: 2000-214577 (2000-08-01), None
patent: 2000-294650 (2000-10-01), None
patent: 2002-244275 (2002-08-01), None
Japanese Official Action and Translation (6 pgs) Date: (Jan. 2003).

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