Method and production of a sensor

Details Method and production of a sensor Method and production of a sensor

2005-11-15

2005-11-15

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S106000

Reexamination Certificate

active

06964927

ABSTRACT:
The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare.

REFERENCES:
patent: 4677526 (1987-06-01), Muehling
patent: 4822552 (1989-04-01), Ahmed et al.
patent: 5859387 (1999-01-01), Gagnon
patent: 5897338 (1999-04-01), Kaldenberg
patent: 5939777 (1999-08-01), Zuniga
patent: 6208020 (2001-03-01), Minamio et al.
patent: 2002/0121680 (2002-09-01), Ahn et al.
patent: 39 20 481 (1989-06-01), None
patent: 199 59 345 (1999-09-01), None
patent: 0398587 (1990-05-01), None
patent: 58021358 (1983-02-01), None

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