Method and process for embedding electrically conductive...

Details Method and process for embedding electrically conductive... Method and process for embedding electrically conductive...

2006-02-13

2009-12-15

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S835000, C029S842000, C029S843000, C029S847000, C029S852000, C257SE21705, C257SE23178

Reexamination Certificate

active

07631423

ABSTRACT:
A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit board. An insulating layer and a conductive layer are then pressed over the electrically conductive elements such that the electrically conductive elements protrude from the surface of the conductive layer. A mechanical process is the applied to remove these protrusions to expose the embedded electrically conductive elements. An electrically conductive undercoat may be applied over the surface of the conductive layer and a second circuit pattern is formed over the electrically conductive undercoat.

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