Electrolysis: processes – compositions used therein – and methods – Electrolytic coating
Patent
1993-04-22
1994-07-26
Valentine, Donald R.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
204224R, 204222, 204240, 204284, 204297R, 204297M, 204DIG7, 204228, C25D 502, C25D 2106, C25D 1708, C25D 2110
Patent
active
053324870
ABSTRACT:
A method of and an apparatus for the electroplating of material onto substrates, such as computer memory disks, by use of a plating cell comprising cathodes, anodes, passive shields, filters, an oscillation system and an electrical power supply. Anodes and magnets are attached to the inside side walls of the plating cell. The magnets have a coating of an electrically nonconducting material covering it. Shields, each having a filter attached to it, are also fixed to the inside side walls. A pallet, having openings for holding disk substrates during electroplating, is placed between the shields in the plating cell. The disk substrates function as cathodes during electrolytic plating. The anodes and cathodes when electrically energized results in deposition of desired material, having uniform thickness, across the entire surface area of the substrate. The shields and the coated magnets function as current shields that control the flow of ions within the plating cell and thereby ensure uniformity of plating thickness at the substrate surface. The magnet also provides a radial flux pattern at the surface of the substrate to orient the deposit on the substrate surface. The oscillation system aids in attaining plating uniformity by ensuring a uniform replenishment of ions at the substrate surface. The pallet and the plating cell designs enable a large number of substrates to be electroplated simultaneously, thereby reducing the cost of plating the substrates.
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Randall Scott L.
Shaw Scott D.
Wylde Andrew F.
Young, Jr. David J.
Cefalo Albert P.
Digital Equipment Corporation
Gupta Krishnendu
Hudgens Ronald C.
Valentine Donald R.
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