Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product
Patent
1988-10-28
1990-03-20
Schilling, Richard L.
Radiation imagery chemistry: process, composition, or product th
Microcapsule, process, composition, or product
430202, 430253, 430311, G03C 554, G03F 700
Patent
active
049101188
ABSTRACT:
Processes for forming metal patterns such as electric circuits and photosensitive materials useful therein are disclosed wherein a layer of photosensitive microcapsules is used to form a pattern of an adhesive, a metallic pigment, a metal salt or a reducing agent by exposing the layer of microcapsules to actinic radiation and transferring the internal phase to a support member. A pattern of the pigment salt or reducing agent is thereby formed on the support member which is treated with an electroless plating solution to form the metal pattern.
REFERENCES:
patent: 3758304 (1973-09-01), Janssen et al.
patent: 3904783 (1975-09-01), Nara et al.
patent: 3950570 (1976-04-01), Kenny
patent: 4084023 (1978-04-01), Dafter
patent: 4239813 (1980-12-01), Murakami et al.
patent: 4399209 (1983-08-01), Sanders et al.
patent: 4440846 (1984-04-01), Sanders et al.
patent: 4451505 (1984-05-01), Jans
patent: 4487811 (1984-12-01), Eichelberger et al.
patent: 4554235 (1985-11-01), Adair et al.
patent: 4608330 (1986-08-01), Marabella et al.
patent: 4687725 (1987-08-01), Wright et al.
patent: 4701397 (1987-10-01), Rourcke et al.
Adair Paul C.
Dowler James A.
Gyure Katherine A.
Schilling Richard L.
The Mead Corporation
LandOfFree
Method and photosensitive material for forming metal patterns em does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and photosensitive material for forming metal patterns em, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and photosensitive material for forming metal patterns em will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-792283