Method and on-chip apparatus for continuity testing

Details Method and on-chip apparatus for continuity testing Method and on-chip apparatus for continuity testing

1988-02-24

1990-01-16

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324158R, G01R 2702, G01R 3128

Patent

active

048946052

ABSTRACT:
A method of performing continuity testing of individual lead sets bonded to an integrated semiconductor component with a continuity test circuit fabricated on the component. The continuity test circuit includes a plurality of current gates, each of which is associated with a different semiconductor component contact pad a lead set is bonded to. Each current gate includes a first terminal connected to the associated contact pad and a second terminal connected to a common conductor all the current gate second terminals are connected to. The common conductor terminates at a semiconductor component contact test pad a lead set is bonded to. Whenever a test signal is applied to either the first or second terminal of a current gate, a measurable response signal is generated by the current gate over the other terminal. Continuity testing of the lead sets bonded to the chip is performed by applying a test signal to either a wiring board conductor connected to the lead set being tested or a wiring board conductor connected to the lead set connected to the semicondcutor component test contact pad. A test probe is then applied to the board conductor the test signal is not applied to. If the response signal is sensed, the leads are properly bonded; if no response signal is detected either the lead set being tested on the lead set connected to the semiconductor component is improperly bonded. The current gate blocks signals on the first terminal from appearing on the second terminal or the common conductor. Thus, when the semiconductor component is in use, the continuity test circuit is isolated from the other individual circuit components forming the integrated semiconductor component.

REFERENCES:
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Blake et al; "Test Site Technology in Integrated Circuits"; IBM Technical Disclosure Bulletin; vol. 10, No. 2; Jul. 1967; pp. 168-169.

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