Fishing – trapping – and vermin destroying
Patent
1986-09-02
1987-12-01
Smith, John D.
Fishing, trapping, and vermin destroying
427 96, 118410, 118411, 118412, B05D 512
Patent
active
047103990
ABSTRACT:
A method and mechanism to form minute drops of solder paste of uniform size spaced in desired patterns upon substrates of semi-conductor devices by extruding the paste under pressure through similar holes in a die while closely spaced above a substrate and, immediately after contacting the ends of minute columns of the paste with the substrate to adhere the same thereto, instantly raising the die to effect separation of the columns from the adhered ends on the substrates which comprise dots of paste of substantially uniform size which are spaced from each other. The paste is dispensed from a shallow reservoir above the die and defined by a flexible diaphragm positioned in opposition to the die and against which a pressure member operates against the diaphragm and paste contained in the reservoir to effect discharge of the paste under pressure as described above.
REFERENCES:
patent: 3970222 (1976-07-01), Duffield
patent: 4154379 (1979-05-01), Schermutzki
patent: 4515297 (1985-05-01), Schoenthaler
patent: 4569305 (1986-02-01), Ferri
patent: 4604633 (1986-08-01), Kimura
patent: 4622239 (1986-11-01), Schoenthaler
Dang Vi Duong
Smith John D.
LandOfFree
Method and mechanism to deposit solder paste upon substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and mechanism to deposit solder paste upon substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and mechanism to deposit solder paste upon substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1930658