Method and means for wave soldering of leads of an integrated ci

Details Method and means for wave soldering of leads of an integrated ci Method and means for wave soldering of leads of an integrated ci

1987-04-29

1988-08-30

Beck, Shrive P.

Coating apparatus

Immersion or work-confined pool type

Work-confined pool

118410, 118416, 118423, 118428, B05C 302, B05C 300

Patent

active

047668423

ABSTRACT:
Solder coating of lead of IC packages is accomplished by passing IC packages on a pallet through a solder wave. The rectangular or square IC packages are positioned so that they are tilted relative to the horizontal and rotated so that a side or adjacent sides of the package enter and exit the solder wave at an angle that is not 90.degree. or 180.degree..

REFERENCES:
patent: 3053215 (1962-09-01), Guty
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3713876 (1973-01-01), Lauric
patent: 4465014 (1984-08-01), Bajka
patent: 4566624 (1986-01-01), Comerford
patent: 4657172 (1987-04-01), Lee
patent: 4666077 (1987-05-01), Rahn
patent: 4695481 (1987-09-01), Kawamata

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