Method and means for positioning surface mounted electronic comp

Details Method and means for positioning surface mounted electronic comp Method and means for positioning surface mounted electronic comp

1991-07-08

1992-04-28

Hille, Rolf

Work holders

Relatively movable jaws

Jaw features

357 80, 357 28, 357 70, 269903, 174 524, 437924, 437204, 437209, 29840, 361403, 439 83, H01L 2302, H01L 3902, H01L 2358, H05K 710

Patent

active

051092697

ABSTRACT:
An SMT electronic component is mounted to a solder-bearing floatation plate by fusible or other heat-responsive releasable mounting means which suspend the component above the floatation plate. The bottom of the floatation plate is effectively substantially the mirror image of a component-positioning pad formed on the board surface adjacent the solder-bearing contact pads corresponding to the electrical contacts on the component. In the assembly process, the floatation plate is placed on the positioning pad. The solder on the bottom of the floatation plate has a melting point lower than the release temperature of the mounting means and the melting point of the solder on the contact pads. With the floatation plate on the component-positioning pad, on heating the solder on the floatation plate liquifies first, wetting the component-positioning pad and floating the floatation plate and component on a thin film of molten solder. Surface tension forces bring the floatation plate into registry with the component-positioning pad. On further heating, the solder on the contact pads liquifies, and the heat-responsive mounting means allows the component to fall freely onto the contact pads. Guide means are provided to prevent rotational and lateral displacement of the component during the fall. The disclosure includes alternative floatation plate constructions and component mounting arrangements.

REFERENCES:
patent: 4595794 (1986-06-01), Wasserman
patent: 4831724 (1989-05-01), Elliott

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