Method and means for electrolytic precleaning of substrates and

Chemistry: electrical and wave energy – Processes and products

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204 14N, 2041415, C25D 344, C25D 534

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active

041265238

ABSTRACT:
Adherent deposits of aluminum can be obtained on metallic substrates by anodic etching of the substrates (reverse current electrolytic cleaning) employing a novel etch solution made as follows:

REFERENCES:
patent: 2170375 (1939-08-01), Mathers et al.
patent: 2873233 (1959-02-01), Schnable
patent: 3699013 (1972-10-01), Miyata
patent: 3969195 (1976-07-01), Dotzer et al.
patent: 3997410 (1976-12-01), Gileadi et al.
The Electrochemical Society Pre-print 65-2, published Apr. 30, 1934.

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