Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1996-09-12
1998-04-14
Loring, Susan A.
Etching a substrate: processes
Forming or treating thermal ink jet article
216 2, 216 33, 347 44, 347 45, B41J 204, B41J 201, B41J 221
Patent
active
057387990
ABSTRACT:
An ink-jet printhead fabrication technique enables capillary channels for liquid ink to be formed with square or rectangular cross-sections. A sacrificial layer is placed over the main surface of a silicon chip, the sacrificial layer being patterned in the form of the void formed by the desired ink channels. A permanent layer, comprising permanent material, is applied over the sacrificial layer, and, after polishing the two layers to form a uniform surface, the sacrificial layer is removed. Preferred materials for the sacrificial layer include polyimide while preferred materials for the permanent layer include polyarylene ether, although a variety of material combinations are possible.
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Atkinson Diane
Burke Cathie J.
Calistri-Yeh Mildred
Hawkins William G.
Hutter R.
Loring Susan A.
Xerox Corporation
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