Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2007-09-10
2011-11-08
Ward, Jessica L (Department: 1735)
Metal fusion bonding
Process
Plural joints
C228S215000
Reexamination Certificate
active
08052035
ABSTRACT:
A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.
REFERENCES:
patent: 5740730 (1998-04-01), Thompson, Sr.
patent: 2002/0146646 (2002-10-01), Jao et al.
patent: 2007/0090171 (2007-04-01), Ochiai et al.
Chan Wan-Chen
Cheng Chi-Hsiung
Li Hsun-Fa
D'Aniello Nicholas
Davidson Berquist Jackson & Gowdey LLP
Universal Global Scientific Industrial Co., Ltd.
Universal Scientific Industrial (Shanghai) Co., Ltd.
Ward Jessica L
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