Method and liquid preparation for removing residues of auxiliary

Details Method and liquid preparation for removing residues of auxiliary Method and liquid preparation for removing residues of auxiliary

1988-03-25

1990-02-13

Pal, Asok

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 41, B08B 308

Patent

active

049003631

ABSTRACT:
A process and liquid preparation is disclosed for removing residues from ers sawn from crystalline rods. In sawing rod-shaped workpieces such as semiconductor rods, for example, into wafers, by means of an internal-hole saw, auxiliary sawing materials such as for example cutting strips are often attached to the rods. According to the present invention, the residues of such auxiliary sawing materials remaining on the wafers obtained after the sawing operation can be removed particularly easily by means of immersion in baths of aqueous carboxylic solutions and, in particular, aqueous formic acid.

REFERENCES:
patent: 3607397 (1971-09-01), Watters et al.
patent: 4508641 (1985-04-01), Hanulek
Aldrich Catalogue, p. 764 (1988-89).
Valtron AD 1210 Ingot Mounting Adhesive, Bulletin No.: AD-6.

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