Method and leadframe for making electronic components

Details Method and leadframe for making electronic components Method and leadframe for making electronic components

1992-11-16

1994-08-30

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257667, 257670, H01L 2348

Patent

active

053430727

ABSTRACT:
A leadframe includes a first longitudinal side band, a second longitudinal side band integrally connected to the first band by transverse sectioning bars spaced longitudinally of the leadframe, a plurality of first leads located closer to the first side band between the respective sectioning bars, and a plurality of second leads integrally connected to the second side band between the respective sectioning bars. The first leads are integrally connected to the respective sectioning bars only via twistably slenderized segments. Each first lead can be turned over toward a corresponding second lead by torsioning the twistable segments.

REFERENCES:
patent: 4809054 (1989-02-01), Waldner
patent: 5049527 (1991-09-01), Merrick et al.
patent: 5070039 (1991-12-01), Johnson et al.

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