Method and its apparatus for inspecting particles or defects...

Optics: measuring and testing – For size of particles – By particle light scattering

Reexamination Certificate

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C356S237500, C356S446000

Reexamination Certificate

active

08072597

ABSTRACT:
Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

REFERENCES:
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patent: 5777327 (1998-07-01), Mizuno
patent: 6256092 (2001-07-01), Tomita et al.
patent: 6384909 (2002-05-01), Tomita et al.
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patent: 7113628 (2006-09-01), Obara et al.
patent: 7115892 (2006-10-01), Nishiyama et al.
patent: 2004/0254752 (2004-12-01), Wisniewski et al.
patent: 62-089336 (1987-04-01), None
patent: 5-273110 (1993-10-01), None
Hall, et al. “Yield Monitoring and Analysis in Semiconductor Manufacturing,” SEMICON 1997 Kansai, Japan, pp. 4-42 thru 4-47 (1997).

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