Method and integrated circuits of module packing

Details Method and integrated circuits of module packing Method and integrated circuits of module packing

2007-09-18

2007-09-18

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S679000

Reexamination Certificate

active

11111727

ABSTRACT:
The present invention provides a modular packing integrated circuit card and its manufacturing method. The above modular packing integrated circuit card comprises a shell, a composite chip unit, and a switch card with a specific interface format. The switch card has a predetermined space for locating the composite chip unit, and enabling the predetermined pins of the composite chip unit to be connected with the predetermined lines of the switch card. The switch card further includes an interface device for a specific interface format so as to connect with the predetermined lines. Finally, the switch card is fastened in the shell. Consequently, the composite chip unit can be manufactured as different interface formats by using different switch cards, such that different interface formats are easier to be exchanged with each other.

REFERENCES:
patent: 2003/0235040 (2003-12-01), Liu et al.
patent: 2005/0279838 (2005-12-01), Wang et al.

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