Method and instrument for measuring semiconductor wafers

Details Method and instrument for measuring semiconductor wafers Method and instrument for measuring semiconductor wafers

2008-05-20

2008-05-20

Nguyen, Tu T (Department: 2886)

Optics: measuring and testing

Dimension

Thickness

Reexamination Certificate

active

07375830

ABSTRACT:
A method of measuring a circular wafer in which the surface (A) of the wafer is divided into a plurality (N) of concentric rings of constant surface area (A/N), and at least one measurement point (Pn) is positioned on each ring. The outside radius (Rn) of each ring is calculated using the following formula:in-line-formulae description="In-line Formulae" end="lead"?Rn=RN(n/N)1/2in-line-formulae description="In-line Formulae" end="tail"?in which n varies from 1 to N. In this manner, rings are obtained that become narrower with increasing distance from the center of the wafer, thereby providing measurement points that become closer together towards the edge of the wafer, and covering only the useful zone of the wafer to be measured, guaranteeing that no measurement is made in an annular exclusion zone.

REFERENCES:
patent: 6624433 (2003-09-01), Okumura et al.
patent: 6954269 (2005-10-01), Gaal et al.
patent: 7084967 (2006-08-01), Nikoonahad et al.
patent: 2002/0193899 (2002-12-01), Shanmugasundram et al.
patent: 2004 012302 (2004-01-01), None
patent: WO 00/54325 (2000-09-01), None

Affiliated with

Also associated with

Rating

Method and instrument for measuring semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and instrument for measuring semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and instrument for measuring semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2809307