Method and improvement to saw system used for cutting...

Details Method and improvement to saw system used for cutting... Method and improvement to saw system used for cutting...

2011-04-05

2011-04-05

Osele, Mark A (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S250000, C156S252000, C156S253000, C156S510000, C156S516000, C156S517000, C156S523000, C156S524000

Reexamination Certificate

active

07918960

ABSTRACT:
A method and an improvement to saw systems configured to convert raw I-joists from inventory to pre-cut sizes and/or cut routed patterns in I-joists for utility pass-through applications prior to their shipment to a construction site or return to inventory, whereby a controlled amount of adhesive and a protective liner are automatically and successively applied to the top flange of each I-joist. The saw system improvement comprises coordinated mechanical, electrical, and pneumatic components.

REFERENCES:
patent: 5676187 (1997-10-01), Owens et al.
patent: 2006/0101785 (2006-05-01), Wiercinski et al.
“Boise Cascade's SawTek automated cutting system”, Publication date: 2003.

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