Method and flip chip structure for power devices

Details Method and flip chip structure for power devices Method and flip chip structure for power devices

2011-08-16

2011-08-16

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S685000, C257S723000, C257SE23031, C257SE23044, C257SE23052, C257SE29345

Reexamination Certificate

active

07999364

ABSTRACT:
A lead frame structure for supporting a semiconductor die is disclosed that includes at least two electrical leads each having a plurality of finger shaped structures unilaterally extending outward from the at least two electrical leads. The electrical leads are arranged so that the plurality of finger shaped structures forms inter-digital patterns where the semiconductor dies are bonded to the lead frame structure.

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