Method and fixturing to perform two side laminations of stacked

Metal working – Method of mechanical manufacture – Electrical device making

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29738, 324760, 269 37, H05K 336

Patent

active

059503033

ABSTRACT:
A substrate stack is suspended within a stack holder to position upper and lower stack surfaces coplanar with upper and lower holder surfaces. Laminating heat and pressure is simultaneously applied to the upper and lower surfaces to laminate a carrier interconnect film to top and bottom stack portions simultaneously. Subsequent wet chemical processing of both stack edges may also be simultaneous to effect savings in manufacturing costs.

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patent: 5377077 (1994-12-01), Burns
patent: 5641371 (1997-06-01), Sanko
patent: 5886535 (1999-03-01), Budnaitis

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