Method and fixture for use in bonding a chip to a substrate

Details Method and fixture for use in bonding a chip to a substrate Method and fixture for use in bonding a chip to a substrate

1997-11-25

1999-07-27

Ryan, Patrick

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228 495, 269 21, 292811, B23K 3700, B23K 3704, B25B 1100, B25B 2714

Patent

active

059275898

ABSTRACT:
A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.

REFERENCES:
patent: 3851758 (1974-12-01), Makhijani et al.
patent: 4607779 (1986-08-01), Burns
patent: 4664309 (1987-05-01), Allen et al.
patent: 4893403 (1990-01-01), Heflinger et al.
patent: 4907959 (1990-03-01), Hauch
patent: 5302801 (1994-04-01), Kanda et al.
patent: 5417408 (1995-05-01), Ueda
patent: 5641112 (1997-06-01), Moradi et al.

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