Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Adhesively bonding resist to substrate
Patent
1995-10-12
1999-03-16
Knode, Marian C.
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
Adhesively bonding resist to substrate
505100, 505450, 505500, 505121, 216100, 216103, 156 8917, 156 47, 156158, 1563046, H01L 21302
Patent
active
058825363
ABSTRACT:
A method of removing a silver cladding from high temperature superconducting material clad in silver (HTS) is disclosed. The silver clad HTS is contacted with an aqueous solution of HNO.sub.3 followed by an aqueous solution of NH.sub.4 OH and H.sub.2 O.sub.2 for a time sufficient to remove the silver cladding from the superconducting material without adversely affecting the superconducting properties of the superconducting material. A portion of the silver cladding may be masked with a material chemically impervious to HNO.sub.3 and to a combination of NH.sub.4 OH and H.sub.2 O.sub.2 to preserve the Ag coating. A silver clad superconductor is disclosed, made in accordance with the method discussed.
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Balachandran Uthamalingam
Huang Jiann Yuan
Iyer Anand N.
Fuldner Rebecca A.
Knode Marian C.
The University of Chicago
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