Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1988-01-27
1989-02-28
Godici, Nicholas P.
Metal fusion bonding
Process
With condition responsive, program, or timing control
2281801, 228260, 228 7, 228 10, 228 37, 228 43, 269 46, 269111, 269903, H05K 334, B23K 3704
Patent
active
048077941
ABSTRACT:
To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).
REFERENCES:
patent: 4363434 (1982-12-01), Flury
EPM AG
Godici Nicholas P.
Heinrich Samuel M.
LandOfFree
Method and equipment to solder printed-circuit assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and equipment to solder printed-circuit assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and equipment to solder printed-circuit assemblies will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1359754