Method and device with variable resilience springs for...

Details Method and device with variable resilience springs for... Method and device with variable resilience springs for...

2006-04-18

2006-04-18

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C439S073000

Reexamination Certificate

active

07030638

ABSTRACT:
An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.

REFERENCES:
patent: 5882221 (1999-03-01), Nguyen et al.
patent: 6025732 (2000-02-01), Foo et al.
patent: 6086387 (2000-07-01), Gallagher et al.
patent: 6304073 (2001-10-01), Saito
Wells-CTI, Phoenix, Arizona, Assembly Drawing, Model No. 693, Part No. 693-1425AB0436A1-0, Dec. 4, 2001.
Wells-CTI, Phoenix, Arizona, Assembly Drawing, Model No. 692, Part No. 692-0575-16, Jun. 1, 2001.
Wells-CTI, Phoenix, Arizona, Assembly Drawing, Model No. 654, Part No. 654048629010808, Apr. 22, 1997.

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