Semiconductor device manufacturing: process – Forming schottky junction – Combined with formation of ohmic contact to semiconductor...
Reexamination Certificate
2008-04-21
2009-11-17
Nguyen, Dao H (Department: 2818)
Semiconductor device manufacturing: process
Forming schottky junction
Combined with formation of ohmic contact to semiconductor...
C438S570000, C438S572000, C438S581000, C438S582000, C438S931000, C257S077000, C257S471000, C257SE21359, C257SE21368, C257SE21470
Reexamination Certificate
active
07618884
ABSTRACT:
A Schottky barrier silicon carbide device has a Re Schottky metal contact. The Re contact27is thicker than 250 Angstroms and may be between 2000 and 4000 Angstroms. A termination structure is provided by ion milling an annular region around the Schottky contact.
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Seng William F.
Witt Carl Anthony
Woodin Richard L.
Fairchild Semiconductor Corporation
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
Nguyen Dao H
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