Metal fusion bonding – Process – With shaping
Reexamination Certificate
2007-02-20
2007-02-20
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
With shaping
Reexamination Certificate
active
10667008
ABSTRACT:
A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.
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Iyer Mahadevan Krishna
Rajoo Ranjan
Wong Ee Hua
Wong Wai Kwan
Agency for Science Technology and Research
Georgia Tech Research Corporation
Johnson Jonathan
Martine & Penilla & Gencarella LLP
National Univeristy of Singapore
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