Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2002-03-04
2004-11-30
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S583200, C438S464000, C438S976000, C029S426600
Reexamination Certificate
active
06824643
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of peeling a semiconductor chip used in a semiconductor device manufacturing process. Also, the present invention relates to a device therefor.
2. Description of the Related Art
Conventionally, a semiconductor device is manufactured in such a manner that, for example, a plurality of semiconductor elements are formed on the first surface of a silicon wafer (semiconductor substrate), and this silicon wafer is diced so as to separate the semiconductor elements (silicon chips) from each other. The silicon wafer is adhered to a dicing tape before the dicing, and when dicing is completed, the silicon chips, which are separated from each other, are adhered to the dicing tape. The silicon chip is peeled from the dicing tape, by a peeling device, before die-bonding.
In order to peel the silicon chip from the dicing tape, a needle device
34
shown in
FIG. 11
is conventionally used. The needle device
34
includes needles
34
A. The needles
34
A are moved from the lower side of the dicing tape
24
toward the dicing tape
24
and penetrate the dicing tape
24
so that the silicon chip
16
is lifted. There is also provided a needle device in which the needles
34
A do not penetrate the dicing tape
24
.
Japanese Unexamined Patent Publication No. 10-189690 discloses a peeling device, in which needles are arranged at positions close to the four corners and at a position close to the center of a silicon chip. The needles arranged at the positions close to the four corners are operated first, and then the needle arranged at the position close to the center is operated, so that the silicon chip can be peeled off stepwise from the four corner portions toward the central portion.
Japanese Unexamined Patent Publication No. 6-338527 discloses a peeling device in which needles are not used but a silicon chip is peeled off from a dicing tape by attracting the dicing tape from the lower side thereof by a peeling device having suction grooves. Japanese Unexamined Patent Publication No. 2001-118862 discloses a peeling device in which a dicing tape is peeled off from a dicing tape, by attracting the dicing tape from the lower side thereof by suction grooves and moving a stage in parallel.
Recently, there has been an increasing demand for reducing the thickness of a silicon wafer and the thickness of silicon chips. However, as the thickness of the silicon wafer is reduced, it becomes difficult to peel the silicon chips from the dicing tape. For example, when the thickness of the silicon chip is reduced, there is a tendency that the needles pierce the silicon chip after they have penetrated the dicing tape.
Further, when the thickness of the silicon chip is reduced, it tends to be deformed. For example, as shown in
FIG. 12
, the dicing tape
24
and the silicon chip
16
are deformed into concaved shapes at positions where the needles
34
A come into contact with the dicing tape
24
and the silicon chip
16
as shown in FIG.
12
. Therefore, the silicon chip
16
may be damaged or cracked. A similar problem arises in a case where the dicing tape is attracted from the lower side thereof by suction grooves.
Further, in order to peel the silicon chip
16
off from the dicing tape
24
, it is necessary that air enters the interface between the silicon chip
16
and the dicing tape
24
and spreads over the interface. In the case where the needles do not penetrate and tear the dicing tape
24
, air does not enter the interface first at the central portion of the silicon chip
16
, but air enters the interface in the outer circumferential portion of the silicon chip
16
. Therefore, peeling occurs only in the outer circumferential portion of the silicon chip
16
. In the circumstance shown in
FIG. 12
, it becomes difficult for the silicon chip
16
to be peeled off from the dicing tape
24
, and the silicon chip
16
tends to be damaged.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a method of peeling a semiconductor chip and a device thereof capable of securely peeling a semiconductor chip off from a dicing tape even when the thickness of the semiconductor chip is thin.
A method of peeling a semiconductor chip, according to the present invention, comprises the steps of peeling a semiconductor chip, adhered to a tape, from the tape using a peeling device including a plurality of annular contact members arranged one after another from the outside to the inside, wherein the plurality of annular contact members are operated so that the semiconductor chip is successively peeled off from the tape from an outer circumferential portion thereof toward a central portion thereof.
A device of peeling a semiconductor chip, adhered to a tape, from the tape, according to the present invention, comprises a plurality of annular contact members arranged one after another from the outside to the inside, and an operation device for operating the plurality of annular contact members so that the semiconductor chip is successively peeled off from the tape from an outer circumferential portion thereof to a central portion thereof.
In the above method and device, the semiconductor chip is successively peeled off from the tape from the outer circumferential portion toward the central portion by the peeling device including a plurality of annular contact members which are arranged one after another from the outside to the inside in order. Accordingly, even when the thickness of the semiconductor chip is small, the semiconductor chip can be securely peeled off from the tape.
REFERENCES:
patent: 3785507 (1974-01-01), Wiesler et al.
patent: 4850780 (1989-07-01), Safabakhsh et al.
patent: 2003/0077854 (2003-04-01), Teshirogi et al.
patent: 1304728 (2003-04-01), None
patent: 62-166536 (1987-07-01), None
patent: 2-66957 (1990-03-01), None
patent: 6-338527 (1994-12-01), None
patent: 10-189690 (1998-07-01), None
patent: 2000-353710 (2000-12-01), None
patent: 2001-118862 (2001-04-01), None
Teshirogi Kazuo
Yoshida Eiji
Yoshimoto Kazuhiro
Osele Mark A.
Westerman Hattori Daniels & Adrian LLP
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