Method and device of deposition through vacuum evaporation makin

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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118723, 118726, 4272481, C23C 1312

Patent

active

043036945

ABSTRACT:
A method and device for depositing through vacuum evaporation. In a first step of said method, and in order to deposit a material on the substrates, the latter is placed in a vacuum enclosure opposite a target of the said material then the target is bombarded by means of an electron-beam; in the subsequent steps, the said beam is modulated and a screen opaque to X-rays is moved between the target and the substrate in synchronism with said modulation, in such manner that said screen be permanently placed between said substrates and the target impact area, and that said substrates be directly seen only from those areas of the target that have just been bombarded.

REFERENCES:
patent: 3333982 (1967-08-01), Horn et al.

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