Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2008-06-03
2008-06-03
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S119000, C257S778000, C257S783000
Reexamination Certificate
active
07381590
ABSTRACT:
A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.
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Choudhary Rehan
Fasano Benjamin V.
Iruvanti Sushumna
Reinhardt Daniel D.
Sylvester Deborah A.
Cioffi James J.
Greenblum & Bernstein P.L.C.
International Business Machines - Corporation
Picardat Kevin M
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