Method and device for time measurement on semiconductor...

Details Method and device for time measurement on semiconductor... Method and device for time measurement on semiconductor...

2005-05-17

2005-05-17

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

06894525

ABSTRACT:
A method and a device for time measurement at a designated signal pin or associated solder pad on a semiconductor module on which semiconductor chips are mounted using the ball-grid-array technique. Integrated on the semiconductor module in the direct vicinity of a solder pad associated with the signal pin to be measured is an equivalent conductor pattern, which can be loaded with passive components in such a way that, in the loaded state, it forms an equivalent load circuit for the designated signal pin which simulates the time-relevant characteristic electrical values of the designated signal pin. The measurement takes place after connection of the ELC to a solder pad associated with the signal pin, with the semiconductor chip detached from the semiconductor module.

REFERENCES:
patent: 6566751 (2003-05-01), Yun
patent: 6639393 (2003-10-01), Tasker et al.
patent: 6703844 (2004-03-01), Adler et al.
patent: 6750672 (2004-06-01), Tanimura et al.
patent: 100 07 434 (2000-11-01), None
patent: 102 14 148 (2003-02-01), None

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