Method and device for through-hole plating of substrates and...

Details Method and device for through-hole plating of substrates and... Method and device for through-hole plating of substrates and...

2007-04-24

2007-04-24

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S564000, C029S729000, C029S825000, C029S829000, C029S835000, C083S862000, C361S720000, C438S613000

Reexamination Certificate

active

10495564

ABSTRACT:
A method and apparatus for through-contacting flexible substrates1,in particular circuit boards, having electrically conductive contact zones4, 41present on two opposing surfaces1a, 1bof the substrate provides that a cut11is produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areas20, 30adjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ram12,by the action of compressed air13,by applying a vacuum14or by a driving hook15fixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.

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